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Polymeric materials for electronics packaging and interconnection / John H. Lupinski, Robert S. Moore ; editors.

Contributor(s): Lupinski, John H | Moore, Robert S | American Chemical Society. Division of Polymeric Materials : Science and Engineering | American Chemical Society. Division of Polymer Chemistry, Inc | American Chemical Society. Meeting (196th : 1988 : Los Angeles, Calif.).
Material type: materialTypeLabelBookSeries: ACS symposium series ; 407. Publisher: Washington, D.C. : American Chemical Society, 1989. Description: xi, 499 p. : ill. ; 24 cm.ISBN: 0841216797.Call number: 621.381046 POL Subject(s): Electronics packaging -- Materials -- Congresses | Polymers -- CongressesOnline resources: Click here to access online
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Developed from a symposium sponsored by the Divisions of Polymeric Materials : Science and Engineering and of Polymer Chemistry, Inc., at the 196th National Meeting of the American Chemical Society, Los Angeles, California, September 25-30, 1988.

Includes bibliographical references and index.

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